IXYS IC Division
Power Solid State Relays:

Power SIP
Pin-to-pin compatibility with other solid state relays, easy upgrade path
for existing designs, compatibility for new designs
Input to Output Isolation up to 4000Vrms

i4-PAC
Substantially lower power relay junction-to-case thermal impedance
Thermal Impedance = 0.35°C/W
Input to Output Isolation = 2500Vrms

ISOPLUS-264
Substantially lower power relay junction-to-case thermal impedance
Thermal Impedance = 0.30°C/W
Input to Output Isolation = 2500Vrms

Power SOIC
New, low-profile SOIC package, high-current power relays,
enhanced I/O isolation
Input to Output Isolation = 5000Vrms

For power applications requiring a non-biased heat sink with superior thermal management properties, the i4-PAC and ISOPLUS-264 power relays are an ideal solution.

For high-current applications requiring enhanced isolation, the new Power SOIC is an ideal choice.

To upgrade existing designs or to design compatible new designs, select the Power SIP, which offers pin-for-pin compatibility with many existing power relays.

Application Note: AN-145
"Advantages of Solid State Relays over Electromechanical Relays"
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